18885973. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Byung Wook Jung of Suwon-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18885973 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a first substrate that includes a first side and a second side opposite to each other; a semiconductor chip on the second side of the first substrate, and includes a third side and a fourth side opposite to each other; a second substrate between the second side of the first substrate and the third side of the semiconductor chip, and includes a fifth side and a sixth side opposite to each other; a first connecting structure electrically connecting the first substrate and the second substrate, between the first substrate and the second substrate; a second connecting structure electrically connecting the second substrate and the semiconductor chip, between the second substrate and the semiconductor chip; and a coil structure that includes a plurality of conductive layers, and is placed in at least one of the first substrate, the second substrate, and the semiconductor chip.