18884732. SEMICONDUCTOR CHIP (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR CHIP
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Inventor(s)
SEMICONDUCTOR CHIP
This abstract first appeared for US patent application 18884732 titled 'SEMICONDUCTOR CHIP
Original Abstract Submitted
A semiconductor chip includes a base substrate including a first surface, a second surface opposite to the first surface, and a sidewall extending between the first surface and the second surface, and a device layer on the first surface of the base substrate, wherein the base substrate includes a stress relief region within a first depth from the second surface and a second depth from the sidewall, and at least a portion of the sidewall of the base substrate is recessed inward from the sidewall of the device layer.