18884484. PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS (SHIN-ETSU CHEMICAL CO., LTD.)
PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS
Organization Name
Inventor(s)
Hitoshi Maruyama of Annaka-shi JP
PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS
This abstract first appeared for US patent application 18884484 titled 'PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS
Original Abstract Submitted
The photosensitive resin composition can be used to form a fine size pattern. The photosensitive resin composition includes: (A) a silicone resin that has a silphenylene structure, a polysiloxane structure, and a fluorene structure at a main chain and has an acryloyl group or a methacryloyl group at a side chain; and (B) a photoradical generator.
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