SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 18884400 titled 'SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

A method of manufacturing a semiconductor substrate includes (a) preparing a substrate having a front surface, a back surface located on an opposite side of the front surface, a first sloped portion connected to the front surface, and a second sloped portion connected to the back surface, (b) forming an epitaxial layer on the front surface and the first sloped portion, (c) after the (b), polishing the back surface, and (d) after the (c), grinding the first sloped portion.