18883372. INJECTION MOLDING SYSTEM (SEIKO EPSON CORPORATION)
INJECTION MOLDING SYSTEM
Organization Name
Inventor(s)
Seijun Horie of Matsumoto-shi JP
Kazunobu Maruyama of Shiojiri-shi JP
Kai Uchiyama of Matsumoto-shi JP
Hiroki Takano of Matsumoto-shi JP
INJECTION MOLDING SYSTEM
This abstract first appeared for US patent application 18883372 titled 'INJECTION MOLDING SYSTEM
Original Abstract Submitted
An injection molding system including an injection molding device including an injection molding section that has a fixed section to which a fixed molding die and a movable molding die are attached and fixed and that is configured to mold a molded article by injecting a material containing a metal powder into a cavity, and a first movement section for moving the movable molding die between a molding die closed position and a molding die open position, a cleaning device that performs cleaning of the molded article by blowing air, and a control device, wherein when the movable molding die is not at the molding die closed position, the control device does not cause the cleaning device to blow air, and when the movable molding die is at the molding die closed position, the control device causes the cleaning device to perfom blowing of air.