METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

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METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

This abstract first appeared for US patent application 18835728 titled 'METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

Original Abstract Submitted

This transmission board production method is for producing a plurality of transmission boards from a panel having a copper foil on a surface thereof, the plurality of transmission boards each including a transmission path, the transmission board production method including: a resist formation step of forming a photoresist on the copper foil; an exposure step of irradiating the photoresist with light via a photomask; a resist removal step of removing, of the photoresist, either of a part irradiated with the light and a part not irradiated with the light; and an etching step of performing wet etching at a part, of the copper foil, exposed through the resist removal step, using an etching solution. The photomask includes a pattern for forming the transmission path included in each of the plurality of transmission boards, so that the transmission paths are along each other. The photomask is formed so that, of the copper foil, a part around each of a plurality of the transmission paths to be formed through the etching step is removed or remains such that a part where the copper foil remains and a part where the copper foil does not remain are not mixed, through the etching step. In the etching step, the etching solution moves relative to the panel along each transmission path to be formed through the etching step.