18835156. SENSOR ELEMENT AND MANUFACTURING METHOD THEREFOR (TDK Corporation)

SENSOR ELEMENT AND MANUFACTURING METHOD THEREFOR

Organization Name

TDK Corporation

Inventor(s)

Koji Kuroki of Tokyo JP

Shigeru Shimura of Tokyo JP

SENSOR ELEMENT AND MANUFACTURING METHOD THEREFOR

This abstract first appeared for US patent application 18835156 titled 'SENSOR ELEMENT AND MANUFACTURING METHOD THEREFOR

Original Abstract Submitted

To reliably electrically connect the lead layer and protective film that covers a functional film even when the film thickness of the protective film is very small. After formation of a conductive protective film on the surface of a functional film, reverse sputtering is performed with a part of the surface of the protective film covered with a mask to physically reduce a native oxide film formed on a part of the surface of the protective film that is not covered with the mask. Thereafter, a lead layer is formed on a part of the surface of the protective film that is not covered with the mask. This can remove the native oxide film formed on the protective film without requiring etching. Thus, even when the film thickness of the protective film is very thin, it is possible to electrically connect the lead layer and protective film without damaging the functional film.