18834023. ANOLYTE SOLUTION DOSING FOR ELECTROPLATING APPARATUS (Lam Research Corporation)
ANOLYTE SOLUTION DOSING FOR ELECTROPLATING APPARATUS
Organization Name
Inventor(s)
Marc Quaglio of Sherwood OR US
Lawrence Ossowski of Tigard OR US
Lawrence Kingrey of Oregon City OR US
Nirmal Shankar Sigamani of Sherwood OR US
Jeff Hanson of Happy Valley OR US
ANOLYTE SOLUTION DOSING FOR ELECTROPLATING APPARATUS
This abstract first appeared for US patent application 18834023 titled 'ANOLYTE SOLUTION DOSING FOR ELECTROPLATING APPARATUS
Original Abstract Submitted
An electroplating apparatus comprises an anode chamber flow loop. The anode chamber flow loop comprises an anode chamber that contains an anolyte solution and an anode. A flow meter doses anolyte solution components into the anode chamber flow loop. A first valve manifold supplies components of the anolyte solution to the flow meter. The first valve manifold comprises a first shutoff valve operable to selectively fluidly couple a source of water to the flow meter, and a second shutoff valve operable to fluidly couple sources of acid and bulk inorganic plating components to the flow meter. A second valve manifold is fluidly coupled to the second shutoff valve and comprises a third shutoff valve operable to fluidly couple the source of bulk inorganic plating components to the first valve manifold, and a fourth shutoff valve operable to fluidly couple the source of acid to the first valve manifold.