18833079. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (Tokyo Electron Limited)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Susumu Hayakawa of Kikuchi-gun, Kumamoto JP
Kenji Sekiguchi of Nirasaki-shi, Yamanashi JP
Syuhei Yonezawa of Nirasaki-shi, Yamanashi JP
Yoshihiro Kondo of Koshi-shi, Kumamoto JP
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
This abstract first appeared for US patent application 18833079 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Original Abstract Submitted
A substrate processing apparatus includes a substrate cleaning device; a chip cleaning device; a chip bonding device; a transfer section; a first substrate transfer arm; and a first frame transfer arm. The substrate cleaning device is configured to clean a substrate. The chip cleaning device is configured to clean chips in a state where the chips are attached to a frame via a tape. The chip bonding device is configured to bond the chips to the substrate. The first substrate transfer arm is configured to hold and transfer the substrate. The first frame transfer arm is configured to hold and transfer the frame together with the chips. The first substrate transfer arm transfers the substrate from the substrate cleaning device to the chip bonding device, and the first frame transfer arm transfers the chips together with the frame from the chip cleaning device to the chip bonding device.