MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

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MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

This abstract first appeared for US patent application 18829537 titled 'MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Original Abstract Submitted

A memory device includes a peripheral circuit layer including a peripheral circuit region. A cell layer is arranged at a different vertical level from the peripheral circuit layer and includes a cell region. A core layer is arranged between the peripheral circuit layer and the cell layer and is electrically connected to the peripheral circuit region and the cell region. The cell region includes a plurality of cell banks each including a memory component. The core circuit region includes a plurality of core banks arranged at positions at least partially vertically overlapping the plurality of cell banks, respectively. Each of the plurality of core banks includes a core circuit.