18817595. MULTILAYER ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18817595 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.