ELECTRONIC MODULE

Organization Name

Inventor(s)

ELECTRONIC MODULE

This abstract first appeared for US patent application 18813289 titled 'ELECTRONIC MODULE

Original Abstract Submitted

A semiconductor element having a structure in which a wiring layer, an element formation layer, and a first insulating layer are stacked is mounted on a first surface of a module substrate in a state where the wiring layer faces the module substrate. The electronic component is mounted on the first surface of the module substrate. A resin layer is on the first surface of the module substrate. First and second recessed portions are in the resin layer, a semiconductor element is in the first recessed portion, and the electronic component is in the second recessed portion. When the first surface is set as a height reference, an upper surface of the resin layer includes a region which is higher than or equal to heights of an upper surface of the semiconductor element and an upper surface of the electronic component, around the semiconductor element and the electronic component.