18812291. Aqueous Adhesive Composition (SEIKO EPSON CORPORATION)
Aqueous Adhesive Composition
Organization Name
Inventor(s)
Harunobu Komatsu of Matsumoto (JP)
Nikako Tsukiji of Matsumoto (JP)
Soichi Yamazaki of Shiojiri (JP)
Aqueous Adhesive Composition
This abstract first appeared for US patent application 18812291 titled 'Aqueous Adhesive Composition
Original Abstract Submitted
An aqueous adhesive composition to form an adhesive layer on a surface of a cloth transport member of an ink jet printing apparatus includes a (meth)acrylic-based resin and water, and the adhesive layer has a storage modulus at 23° C. of 1.5×10to 5.0×10Pa.