18812260. Aqueous Adhesive Composition (SEIKO EPSON CORPORATION)
Aqueous Adhesive Composition
Organization Name
Inventor(s)
Harunobu Komatsu of Matsumoto (JP)
Nikako Tsukiji of Matsumoto (JP)
Soichi Yamazaki of Shiojiri (JP)
Aqueous Adhesive Composition
This abstract first appeared for US patent application 18812260 titled 'Aqueous Adhesive Composition
Original Abstract Submitted
An aqueous adhesive composition forms an adhesive layer on a surface of a cloth transport member of an ink jet printing apparatus, the aqueous adhesive composition including a (meth)acrylic-based resin and water, the (meth)acrylic-based resin containing a first (meth)acrylic-based resin having a glass transition temperature Tg and a second (meth)acrylic-based resin having a glass transition temperature Tg which is lower than the glass transition temperature Tg, the first (meth)acrylic-based resin including a methyl methacrylate or ethyl methacrylate as one of constituent units. In the aqueous adhesive composition described above, a total content of the methyl methacrylate and the ethyl methacrylate with respect to all the constituent units of the first (meth)acrylic-based resin is 10 to 41 percent by mass.