18810030. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18810030 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device includes a semiconductor substrate on which a plurality of trenches are formed, an interlayer insulating film formed on the semiconductor substrate, a contact hole made in the interlayer insulating film, and an electrode connected to a semiconductor mesa portion that is a portion between the trenches of the semiconductor substrate through the contact hole. A side wall of the contact hole has a stepped shape having at least one step. A bottom of the contact hole is located on the semiconductor mesa portion, and an upper end of the contact hole is located outside the semiconductor mesa portion.