18808733. Method and Apparatus for Estimating Cyclic Thermal Stress (ABB Schweiz AG)
Method and Apparatus for Estimating Cyclic Thermal Stress
Organization Name
Inventor(s)
Juri Voloskin of Helsinki (FI)
Martti Mattila of Helsinki (FI)
Jarno Kukkola of Helsinki (FI)
Method and Apparatus for Estimating Cyclic Thermal Stress
This abstract first appeared for US patent application 18808733 titled 'Method and Apparatus for Estimating Cyclic Thermal Stress
Original Abstract Submitted
A method and apparatus for estimating a cyclic thermal stress of a power semiconductor device, the apparatus being configured to receive temperature data indicative of a temperature relating to the power semiconductor device, extract, from the received temperature data, thermal cycle data on characteristic quantities of one or more thermal cycles of the power semiconductor device, determine a thermal cycling operating point of the power semiconductor device on the basis of the extracted thermal cycle data, and determine an estimate of the cyclic thermal stress of the power semiconductor device on the basis of the determined thermal cycling operating point of the power semiconductor device and a cyclic thermal stress model of the power semiconductor device, wherein the cyclic thermal stress model includes data indicative of a stress level of the power semiconductor device at predetermined thermal cycling operating points of the power semiconductor device.