MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Seung Min Kang of Suwon-si KR

Dae Hee Lee of Suwon-si KR

Sun Ju Hwang of Suwon-si KR

Chan Ho Yang of Suwon-si KR

MULTILAYER ELECTRONIC COMPONENT

This abstract first appeared for US patent application 18808544 titled 'MULTILAYER ELECTRONIC COMPONENT

Original Abstract Submitted

A multilayer electronic component includes a body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the body including a capacitance formation portion including a dielectric layer and an internal electrode, and a cover portion, and an external electrode. When maximum sizes of the multilayer electronic component in the first to third directions are L, W and T, respectively, average sizes of the cover portion, dielectric layer, and internal electrode in the first direction are tc, td, and te, respectively, 0.75 mm≤L≤1.25 mm, 0.25 mm≤W≤0.75 mm, T<0.5 mm, 28 μm≤tc≤34 μm, 0.4 μm≤td≤0.5 μm, and 0.4 μm≤te≤0.5 μm are satisfied.