Electronic Device and Manufacturing Method Thereof

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Electronic Device and Manufacturing Method Thereof

This abstract first appeared for US patent application 18808091 titled 'Electronic Device and Manufacturing Method Thereof

Original Abstract Submitted

An electronic device includes a substrate having opposite first and second surfaces and a through hole having an inner wall connected to the first and second surfaces, a buffer layer covering the first and second surfaces and the inner wall, a conductor disposed in the through hole, a first circuit structure disposed on the first surface, an electronic element disposed on the first circuit structure, and first connectors disposed on the second surface and electrically connected to the electronic element through the conductor and the first circuit structure. The through hole has a width W and a depth D, and W/D is greater than or equal to 0.01 and less than or equal to 0.5. A thickness T of the buffer layer is greater than or equal to 0.01 μm and less than or equal to 10 μm. A manufacturing method of an electronic device is also provided.