ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18807473 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

An electronic package is provided and includes a first circuit structure having opposite first and second surfaces; an electronic component set including a first electronic component and a second electronic component and having opposite first and second sides, wherein the first electronic component is located on the first side and has opposite first active surface and first inactive surface, the second electronic component has opposite second active surface and second inactive surface, and a part of the second active surface protrudes and is exposed from an outside of the first electronic component to electrically connect to the first surface; and an encapsulating layer defining opposite first encapsulating surface and second encapsulating surface, wherein the second encapsulating surface is connected to the first surface. As such, the overall height of the electronic package can be reduced and the heat dissipation efficiency of the electronic package can be improved also.