18807103. PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON (STMicroelectronics International N.V.)

PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON

Organization Name

STMicroelectronics International N.V.

Inventor(s)

Andrea Nomellini of Milan (IT)

Ilaria Gelmi of Verano Brianza (IT)

Federica Capra of Carpaneto Piacentino (IT)

Michele Vimercati of Giussano (IT)

Luca Lamagna of Cassina De' Pecchi (IT)

PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON

This abstract first appeared for US patent application 18807103 titled 'PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON

Original Abstract Submitted

A process for manufacturing a microelectromechanical device includes: on a body containing semiconductor material, forming a sacrificial layer of dielectric material having a first surface, opposite to the body; conferring a sacrificial surface roughness to the first surface of the sacrificial layer; on the first surface of the sacrificial layer, forming a structural layer of semiconductor material having a second surface in contact with the first surface of the sacrificial layer. Conferring sacrificial surface roughness to the first surface of the sacrificial layer includes: on the sacrificial layer, forming a transfer layer of semiconductor material with intrinsic porosity; and partially removing the sacrificial layer through the transfer layer.