18806192. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Chae Dong Lee of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18806192 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body. The external electrode includes a first electrode layer in contact with the internal electrode and a second electrode layer disposed on the first electrode layer. The first electrode layer includes Cu, the second electrode layer includes Cu and SiC, and an area fraction of SiC in the second electrode layer is 5% or more and 20% or less. Moisture resistance reliability and adhesion strength of a multilayer electronic component may be improved.
