18806023. Advanced Substrates for Large, High Performance Power Packages (Google LLC)
Advanced Substrates for Large, High Performance Power Packages
Organization Name
Inventor(s)
Ilyas Mohammed of San Jose CA (US)
Advanced Substrates for Large, High Performance Power Packages
This abstract first appeared for US patent application 18806023 titled 'Advanced Substrates for Large, High Performance Power Packages
Original Abstract Submitted
A package substrate for a microelectronic package assembly includes an inorganic core body, such as a ceramic core body, with embedded capacitors and at least one conductive through via extending through the core body. The structure of the inorganic core body allows for at least one redistribution layer to be built-up directly onto the inorganic core body, without the use of an intermediate carrier or interposer.
