18782386. SEMICONDUCTOR PACKAGE HAVING A CONTROLLER (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
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SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
This abstract first appeared for US patent application 18782386 titled 'SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
Original Abstract Submitted
A semiconductor package includes a substrate having first and second sides, pads disposed on the substrate and including first and second bonding pads adjacent to the first and second sides, respectively, and upper pads between the first and second bonding pads, a passivation layer disposed on the substrate and exposing the first and second bonding pads, a solder resist layer disposed on the passivation layer, a first chip structure on the solder resist layer, adjacent to the first side and electrically connected to the first bonding pads, a second chip structure on the solder resist layer, adjacent to the second side and electrically connected to the second bonding pads, a controller on the solder resist layer between the first and the second chip structure, and a connection structure penetrating the passivation layer and the solder resist layer and electrically connecting the controller and the upper pads.