18778009. APPARATUS FOR DICING WAFER (Samsung Electronics Co., Ltd.)
APPARATUS FOR DICING WAFER
Organization Name
Inventor(s)
Young Chul Kwon of Suwon-si KR
APPARATUS FOR DICING WAFER
This abstract first appeared for US patent application 18778009 titled 'APPARATUS FOR DICING WAFER
Original Abstract Submitted
An apparatus for dicing a wafer includes a stage configured to receive a wafer, and move the wafer in a first direction, and a plurality of laser heads above the stage along the first direction, and as the stage moves the wafer in the first direction, the plurality of laser heads are configured to emit a plurality of laser beams onto the wafer along a plurality of cutting lines, the plurality of cutting lines extending in the first direction and each cutting line spaced apart from other cutting lines in a second direction, the second direction perpendicular to the first direction.