18767424. SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD (SAMSUNG ELECTRONICS CO., LTD.)
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
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SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
This abstract first appeared for US patent application 18767424 titled 'SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Original Abstract Submitted
A substrate processing method includes collecting a plurality of pieces of optical emission spectrometry data including a wavelength, intensity of the wavelength, and time using optical emission spectrometry on a plurality of substrates, selecting a selected wavelength band having a high correlation with an endpoint of an etching process from the plurality of pieces of optical emission spectrometry data, preprocessing the plurality of pieces of optical emission spectrometry data to generate a selected dataset, generating a principal component analysis model using the selected dataset, generating a probability distribution model capable of clustering data of the principal component analysis model, and performing the etching process on a process substrate using the principal component analysis model and the probability distribution model.
