TEST SOCKET FOR A COMPONENT

Organization Name

Inventor(s)

TEST SOCKET FOR A COMPONENT

This abstract first appeared for US patent application 18765078 titled 'TEST SOCKET FOR A COMPONENT

Original Abstract Submitted

A test apparatus includes an image sensor module including a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal. The controller may control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and the criteria temperature range is a temperature range within a preset range from the target temperature.