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18762949. HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME (Infineon Technologies AG)

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HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

Organization Name

Infineon Technologies AG

Inventor(s)

Georg Troska of Frondenberg (DE)

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

This abstract first appeared for US patent application 18762949 titled 'HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME



Original Abstract Submitted

A housing for a power semiconductor module arrangement includes sidewalls and a top. The top includes a first layer of a first material having a plurality of openings, and a second layer of a second material that is different from the first material. The second material has a comparative tracking index (CTI) that is higher than a comparative tracking index of the first material. The second layer partly covers at least one of a bottom surface of the first layer and a top surface of the first layer, and/or the first layer includes at least one gap sealed by a section of the second layer such that the second layer forms at least one section of the housing.

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