18759408. POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD (EBARA CORPORATION)
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
Organization Name
Inventor(s)
Masaki Kinoshita of Tokyo (JP)
Toshiki Miyakawa of Tokyo (JP)
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
This abstract first appeared for US patent application 18759408 titled 'POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
Original Abstract Submitted
A polishing apparatus is disclosed. The polishing apparatus can stabilize an optical path in a space between a transparent window of a polishing pad and an optical sensor head, thereby achieving accurate measuring of a film thickness of a workpiece. polishing apparatus includes: a polishing pad having a transparent window configured to allow light to pass therethrough; a polishing table supporting the polishing pad; a polishing head configured to press a workpiece against the polishing pad; and an optical film-thickness measuring system having an optical sensor head disposed below the transparent window, a space formed between the transparent window and the optical sensor head being filled with a transparent liquid.