18757943. THERMAL MANAGEMENT CIRCUIT (TOYOTA JIDOSHA KABUSHIKI KAISHA)
THERMAL MANAGEMENT CIRCUIT
Organization Name
TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor(s)
Hidefumi Aikawa of Okazaki-shi JP
THERMAL MANAGEMENT CIRCUIT
This abstract first appeared for US patent application 18757943 titled 'THERMAL MANAGEMENT CIRCUIT
Original Abstract Submitted
The thermal management circuit includes a battery circuit (first circuit), a refrigeration cycle, and a heat dissipation circuit (second circuit). The heat dissipation circuit includes a flow path (first flow path), a flow path (second flow path), and a flow path (third flow path). The flow path connects the port (outlet port) of the condensing portion and the upstream-side HT radiator (upstream-side radiator). The flow path branches from a flow path connecting the upstream-side HT radiator and the downstream-side HT radiator (downstream-side radiator), and is connected to a port (inlet port) of the condensing portion. The flow path connects a port (inlet port) of the subcooling unit (supercooling portion) to the downstream-side HT radiator.