18756209. SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18756209 titled 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD
The method described in the abstract involves the formation of an optical component and three thermal control mechanisms over a substrate. The optical component consists of main paths and side paths, with thermoelectric members and conductive structures in each thermal control mechanism.
- The optical component includes main paths and side paths.
- Three thermal control mechanisms are integrated into the structure.
- Thermoelectric members with opposite conductivity types are used in the thermal control mechanisms.
- The side paths are positioned between the thermal control mechanisms.
- The design allows for precise temperature control of the optical component.
Potential Applications: - Optical systems requiring precise temperature control. - Scientific instruments with sensitive optical components. - Aerospace technology for thermal management in space.
Problems Solved: - Maintaining stable temperatures in optical components. - Preventing thermal fluctuations that can affect performance. - Ensuring reliability and longevity of optical systems.
Benefits: - Improved accuracy and stability in optical systems. - Enhanced performance and longevity of optical components. - Greater control over thermal management in sensitive applications.
Commercial Applications: Title: Precision Thermal Control System for Optical Components This technology can be utilized in: - High-end cameras and imaging systems. - Laser systems for medical or industrial applications. - Satellite and space exploration equipment.
Questions about Precision Thermal Control System for Optical Components: 1. How does this technology compare to traditional thermal control methods in optical systems? 2. What are the potential cost implications of implementing this precision thermal control system in commercial applications?
Original Abstract Submitted
A method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. The optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. The second side path is spaced from the first side path. Each of the first, second and third thermal control mechanisms includes a first thermoelectric member having a first conductivity type, a second thermoelectric member having a second conductivity type opposite to the first conductivity type, and a conductive structure that electrically connects the first thermoelectric member to the second thermoelectric member. The first side path is between the first and third thermal control mechanisms. The second side path is between the second and third thermal control mechanisms. The third thermal control mechanism is between the first and second side paths.