METHOD OF FORMING SEMICONDUCTOR PACKAGE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

METHOD OF FORMING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18751362 titled 'METHOD OF FORMING SEMICONDUCTOR PACKAGE

The abstract of the patent application describes a method of forming a semiconductor package involving the creation of first and second conductive patterns to form coils around a die.

Simplified Explanation:

- The method involves providing a first die with first conductive patterns. - Second conductive patterns are formed over the first die to create coils surrounding the first die.

Key Features and Innovation:

- Formation of first and second conductive patterns. - Creation of coils around the first die.

Potential Applications:

- Semiconductor packaging. - Electronics manufacturing.

Problems Solved:

- Efficient formation of semiconductor packages. - Improved connectivity within the package.

Benefits:

- Enhanced performance of semiconductor devices. - Increased reliability of electronic components.

Commercial Applications:

- Semiconductor industry applications. - Electronics manufacturing market implications.

Questions about Semiconductor Packaging:

1. What are the specific advantages of using coils in semiconductor packaging? - Coils in semiconductor packaging can improve signal integrity and reduce electromagnetic interference.

2. How does the formation of second conductive patterns enhance the functionality of the semiconductor package? - The second conductive patterns provide additional connectivity and support within the package.

By optimizing the content for SEO and providing detailed information on the technology, this article aims to educate readers on the innovative method of forming semiconductor packages described in the patent application.

Original Abstract Submitted

A method of forming a semiconductor package includes the following steps. A first die is provided, wherein the first die comprises a plurality of first conductive patterns. A plurality of second conductive patterns are formed over the first die, wherein the second conductive patterns are connected to the first conductive patterns to form a first coil and a second coil surrounding the first coil.