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18750287. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)

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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Organization Name

Tokyo Electron Limited

Inventor(s)

Shota Umezaki of Koshi City (JP)

Hiroaki Inadomi of Koshi City (JP)

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18750287 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The patent application describes a substrate processing apparatus that includes a transfer block for transferring a substrate and a processing block for forming a liquid film on the substrate's surface and drying it with a supercritical fluid.

  • Transfer block with a transfer device for moving substrates.
  • Processing block with a liquid film forming unit and a drying unit using supercritical fluid.
  • Drying unit includes a pressure vessel, cover body, and supporting body for holding the substrate horizontally.
  • Transfer device moves into the drying chamber to dry the substrate with the liquid film.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production

Problems Solved: - Efficient drying of substrates with liquid films - Precise control over drying process - Minimization of contamination risks

Benefits: - Improved substrate processing efficiency - Enhanced quality of dried substrates - Reduced production costs

Commercial Applications: - Advanced manufacturing processes - Research and development labs - High-tech industries

Questions about the technology: 1. How does the use of supercritical fluid improve the drying process compared to traditional methods? 2. What are the potential challenges in scaling up this technology for industrial applications?

Frequently Updated Research: - Ongoing studies on the optimization of supercritical fluid drying processes for various substrates.


Original Abstract Submitted

A substrate processing apparatus includes a transfer block in which a transfer device configured to transfer a substrate is placed, and a processing block provided adjacent to the transfer block. The processing block includes a liquid film forming unit configured to form a liquid film on a top surface of the substrate which is held horizontally, and a drying unit configured to replace the liquid film with a supercritical fluid to dry the substrate. The drying unit includes a pressure vessel having therein a drying chamber for the substrate, a cover body configured to close an opening of the drying chamber, and a supporting body configured to support the substrate horizontally in the drying chamber. The supporting body is fixed to the drying chamber. The transfer device advances into the drying chamber through the opening of the drying chamber while holding horizontally the substrate having the liquid film thereon.

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