Chip Management Apparatus and Related Method

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Chip Management Apparatus and Related Method - A simplified explanation of the abstract

This abstract first appeared for US patent application 18748324 titled 'Chip Management Apparatus and Related Method

Simplified Explanation: This patent application describes a chip management apparatus and method that improves the processing performance of computing nodes by grouping them based on their interconnection relationships and computing power.

Key Features and Innovation:

Device management unit obtains interface information of computing nodes and determines interconnection relationships.
System management unit groups computing nodes into collaboration groups based on interconnection relationships and computing power.
Collaboration groups consist of physically interconnected nodes with the same computing power.
Enhances processing performance of computing nodes.

Potential Applications: This technology can be applied in data centers, supercomputers, cloud computing systems, and other high-performance computing environments.

Problems Solved: Addresses the need for efficient management and optimization of computing resources in complex systems with multiple nodes.

Benefits:

Improved processing performance of computing nodes.
Enhanced efficiency in resource allocation.
Simplified management of interconnected computing nodes.

Commercial Applications: The chip management apparatus can be utilized in industries requiring high-performance computing, such as scientific research, financial modeling, and artificial intelligence development.

Prior Art: Readers can explore prior art related to chip management systems, interconnection optimization, and computing node grouping techniques in the field of high-performance computing.

Frequently Updated Research: Stay updated on research advancements in chip management, system optimization, and collaborative computing in high-performance environments.

Questions about Chip Management Technology: 1. How does this chip management apparatus improve processing performance in computing nodes? 2. What are the potential implications of grouping computing nodes based on interconnection relationships and computing power?

Original Abstract Submitted

This application discloses a chip management apparatus and a related method. The chip management apparatus includes a device management unit, a system management unit, and N computing nodes. The device management unit is configured to: obtain interface information of each of the N computing nodes, and determine an interconnection relationship between the N computing nodes based on the interface information of the N computing nodes. The system management unit is configured to group, based on the interconnection relationship between the N computing nodes and computing power information of the N computing nodes, the N computing nodes into M first collaboration groups. Each of the M first collaboration groups includes at least one computing node, and the at least one computing node included in each first collaboration group has a same computing power and is physically interconnected. According to embodiments, processing performance of a computing node can be improved.