SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 18748295 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

A semiconductor package includes: a first redistribution structure including a first upper connection pad and a first lower connection pad; a first semiconductor device on the first redistribution structure; a vertical connection conductor on the first redistribution structure; an encapsulant adjacent to the first semiconductor device; a second redistribution structure on the encapsulant and including a second redistribution pattern, a second insulating layer, a second upper connection pad, and a second lower connection pad; an insulating adhesive layer between the second redistribution structure and the encapsulant; and an intermediate connection terminal connecting the second lower connection pad with the vertical connection conductor, wherein the second upper connection pad is exposed by an upper opening of the second insulating layer. A cover conductive layer is on the second upper connection pad. A side surface of the intermediate connection terminal is covered with the insulating adhesive layer and the encapsulant.