18747987. CHIP ON FLEX simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
CHIP ON FLEX
Organization Name
Chengdu BOE Optoelectronics Technology Co., Ltd.
Inventor(s)
Jiangsheng Wang of Beijing (CN)
CHIP ON FLEX - A simplified explanation of the abstract
This abstract first appeared for US patent application 18747987 titled 'CHIP ON FLEX
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base with metal bonding pads and a reinforcement sheet.
- Flexible base with a first opening and a bonding area with metal bonding pads
- Spacing area with a preset range between the first opening and the bonding area
- Reinforcement sheet located on a portion of the flexible base other than the first opening, the spacing area, and the bonding area
Potential Applications: - Consumer electronics - Automotive displays - Medical devices
Problems Solved: - Improved durability and flexibility of display devices - Enhanced bonding strength between components
Benefits: - Increased reliability of touch assemblies - Cost-effective manufacturing process - Enhanced overall performance of display devices
Commercial Applications: Title: Advanced Display Technology for Consumer Electronics This technology can be used in smartphones, tablets, and other electronic devices to improve display performance and durability, leading to a better user experience and increased product lifespan.
Questions about Chip on Flex: 1. How does the reinforcement sheet enhance the durability of the chip on flex? The reinforcement sheet provides additional support to the flexible base, improving the overall strength and durability of the chip on flex.
2. What are the potential cost savings associated with using a chip on flex in display devices? Using a chip on flex can streamline the manufacturing process and reduce material costs, leading to overall cost savings for manufacturers.
Original Abstract Submitted
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.