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18746751. LITHOGRAPHY SYSTEM AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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LITHOGRAPHY SYSTEM AND METHODS

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Eng Hock Lee of Hsinchu (TW)

Wen-Hao Cheng of Hsinchu (TW)

LITHOGRAPHY SYSTEM AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18746751 titled 'LITHOGRAPHY SYSTEM AND METHODS

Simplified Explanation: The patent application describes a lithography exposure system that includes a reflector with multiple layers of different materials and thicknesses to improve the efficiency of the system.

  • The lithography exposure system consists of a light source, a substrate stage, and a mask stage.
  • A reflector is placed along the optical path between the light source and the substrate stage.
  • The reflector has multiple layers, including a first layer with a first material and thickness, a second layer with the same material but a different thickness, and a third layer with a different material.

Key Features and Innovation:

  • Multi-layer reflector design for improved efficiency.
  • Different materials and thicknesses in each layer for optimal light reflection.
  • Enhances the lithography exposure system's performance.

Potential Applications:

  • Semiconductor manufacturing.
  • Microelectronics production.
  • Optical device fabrication.

Problems Solved:

  • Improves light reflection in lithography systems.
  • Enhances overall system efficiency.
  • Increases precision in manufacturing processes.

Benefits:

  • Higher quality output.
  • Increased productivity.
  • Cost-effective manufacturing.

Commercial Applications: The technology can be utilized in the semiconductor industry for producing advanced electronic components, in the microelectronics sector for manufacturing small-scale devices, and in the optical industry for creating precision optical components.

Questions about Lithography Exposure System: 1. How does the multi-layer reflector design improve the efficiency of the lithography exposure system? 2. What are the specific advantages of using different materials and thicknesses in each layer of the reflector?

Frequently Updated Research: Ongoing research in the field of lithography systems focuses on further optimizing reflector designs for enhanced performance and exploring new materials for even better light reflection capabilities.


Original Abstract Submitted

A lithography exposure system includes a light source, a substrate stage, and a mask stage between the light source and the substrate stage along an optical path from the light source to the substrate stage. The lithography exposure system further comprises a reflector along the optical path. The reflector comprises: a first layer having a first material and a first thickness; a second layer having the first material and a second thickness different from the first thickness; and a third layer between the first layer and the second layer, and having a second material different from the first material.

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