ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

Organization Name

Inventor(s)

ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

This abstract first appeared for US patent application 18737181 titled 'ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

Original Abstract Submitted

An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. Each of the plurality of antenna elements may have a structure with two patch antennas, and first and second groups of second patch antennas disposed inside the PCB may be located in first and second regions with respect to a center line of an inner layer where the second patch antennas are disposed.