18736157. PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES simplified abstract (Applied Materials, Inc.)
PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES
Organization Name
Inventor(s)
Thomas Joseph Knisley of Livonia MI (US)
Bhaskar Jyoti Bhuyan of San Jose CA (US)
Mark Saly of Santa Clara CA (US)
Mingwei Zhu of San Jose CA (US)
PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18736157 titled 'PRECLEAN AND ENCAPSULATION OF MICROLED FEATURES
Simplified Explanation: The patent application discloses a method for cleaning and encapsulating microLED features, including wet and dry cleaning processes to remove contaminants and improve the crystallinity of the microLED feature and capping layer, leading to enhanced EQE of microLED devices.
Key Features and Innovation:
- Method for cleaning and encapsulating microLED features
- Wet and dry cleaning processes to remove contaminants
- Improved crystallinity of microLED feature and capping layer
- Enhanced EQE of microLED devices
Potential Applications: The technology can be applied in the manufacturing of microLED devices for various applications such as displays, lighting, and wearable devices.
Problems Solved: The technology addresses the challenges of cleaning and encapsulating microLED features to improve device performance and reliability.
Benefits:
- Improved cleanliness and encapsulation of microLED features
- Enhanced device performance and reliability
- Increased efficiency and brightness of microLED devices
Commercial Applications: The technology can be utilized in the production of high-quality microLED displays for consumer electronics, automotive displays, and augmented reality devices, potentially capturing a significant market share in the display industry.
Prior Art: Readers can explore prior research on microLED cleaning and encapsulation methods in the semiconductor industry to understand the evolution of this technology.
Frequently Updated Research: Stay updated on the latest advancements in microLED technology, including new cleaning and encapsulation techniques, to enhance device performance and efficiency.
Questions about MicroLED Cleaning and Encapsulation: 1. What are the key benefits of using both wet and dry cleaning processes for microLED features? 2. How does improved crystallinity of microLED features contribute to enhanced EQE in microLED devices?
Original Abstract Submitted
Method for cleaning and encapsulating microLED features are disclosed. Some embodiments provide for a wet clean process and a dry clean process to remove contaminants from the microLED feature. Some embodiments provide for the encapsulation of a clean microLED feature. Some embodiments provide improved crystallinity of the microLED feature and the capping layer. Some embodiments provide improved EQE of microLED devices formed from the disclosed microLED features.