18735565. Device Node and Liquid Cooling Cabinet simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Device Node and Liquid Cooling Cabinet
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Inventor(s)
Device Node and Liquid Cooling Cabinet - A simplified explanation of the abstract
This abstract first appeared for US patent application 18735565 titled 'Device Node and Liquid Cooling Cabinet
Simplified Explanation:
The patent application describes a device node that includes a circuit board, a heat dissipation component, and a housing with a cold liquid inlet and a liquid return outlet. The circuit board and heat dissipation component are housed within the device, with at least one main chip on the circuit board. The heat dissipation component consists of a spray plate and liquid cold plates that form a liquid cooling network.
- The device node includes a circuit board, heat dissipation component, and housing with liquid cooling channels.
- Liquid cold plates form a liquid cooling network that is connected to a cold liquid inlet.
- The spray plate has liquid spray holes that face the circuit board for efficient cooling.
Key Features and Innovation:
- Integration of liquid cooling channels within the device node for effective heat dissipation.
- Liquid cold plates and spray plate design optimize cooling efficiency.
- Liquid cooling network ensures uniform cooling of the main chip on the circuit board.
Potential Applications:
- Data centers
- High-performance computing systems
- Industrial machinery
Problems Solved:
- Overheating of electronic components
- Inefficient heat dissipation
- Limited cooling capacity
Benefits:
- Improved thermal management
- Enhanced performance and reliability of electronic devices
- Energy efficiency
Commercial Applications:
Liquid cooling technology in electronic devices can revolutionize the efficiency and performance of various industries, including data centers, high-performance computing, and industrial machinery.
Questions about Liquid Cooling Technology:
1. How does liquid cooling technology compare to traditional air cooling methods?
Liquid cooling technology offers more efficient heat dissipation and can handle higher thermal loads compared to traditional air cooling methods.
2. What are the key considerations when implementing liquid cooling technology in electronic devices?
Key considerations include the design of the liquid cooling system, the choice of coolant, and the maintenance requirements for optimal performance.
Original Abstract Submitted
A device node is provided. The device node includes a circuit board, a heat dissipation component and a housing having a cold liquid inlet and a liquid return outlet. The circuit board and the heat dissipation component are disposed in the housing, and at least one main chip is disposed on the circuit board. The heat dissipation component includes a spray plate and at least one liquid cold plate. Each liquid cold plate is configured to form a liquid cooling channel. Liquid cooling channels of all liquid cold plates are communicated to form a liquid cooling network. An inlet of the liquid cooling network is communicated with the cold liquid inlet. The spray plate has a spray channel communicated with an outlet of the liquid cooling network and liquid spray holes communicated with the spray channel, and a liquid outlet end of the liquid spray hole faces the circuit board.