Jump to content

18734566. CHIP AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)

From WikiPatents

CHIP AND OPTICAL COMMUNICATION DEVICE

Organization Name

HUAWEI TECHNOLOGIES CO., LTD.

Inventor(s)

Limin Chang of Wuhan (CN)

Hongmin Chen of Shenzhen (CN)

Mengdie Sun of Shenzhen (CN)

Li Yang of Shenzhen (CN)

Xin Chen of Wuhan (CN)

Jun Yuan of Shenzhen (CN)

CHIP AND OPTICAL COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18734566 titled 'CHIP AND OPTICAL COMMUNICATION DEVICE

The abstract describes a chip with a substrate, an insulation layer, and two waveguides. The second waveguide has lower transmission loss than the first waveguide and is positioned away from the substrate. The chip enables optical coupling between the two waveguides.

  • The chip includes a substrate, insulation layer, and two waveguides.
  • The second waveguide has lower transmission loss than the first waveguide.
  • Optical coupling is achieved between the two waveguides.
  • The second waveguide is positioned away from the substrate.
  • The chip enables efficient optical communication.

Potential Applications: - Optical communication systems - Data transmission devices - Telecommunication networks

Problems Solved: - Reduced transmission loss in waveguides - Improved optical coupling efficiency

Benefits: - Enhanced data transmission speed - Increased reliability in optical communication - Potential for smaller and more efficient devices

Commercial Applications: Title: "Optical Communication Chip for High-Speed Data Transmission" This technology can be utilized in: - Fiber optic communication equipment - Data centers - Telecommunication infrastructure development

Questions about the technology: 1. How does the chip improve optical coupling efficiency between waveguides?

  The chip utilizes a first coupling structure to enable efficient optical coupling between the two waveguides.

2. What are the potential advantages of using a chip with lower transmission loss in optical communication systems?

  Lower transmission loss leads to improved data transmission speed and reliability in optical communication systems.


Original Abstract Submitted

An example chip may include a substrate, an insulation layer located on a side of the substrate, and a first waveguide and a second waveguide that are in the insulation layer. The second waveguide is located on a side of the first waveguide away from the substrate. A transmission loss of the second waveguide is smaller than a transmission loss of the first waveguide. A first coupling portion of the first waveguide and a second coupling portion of the second waveguide form a first coupling structure, and the first coupling structure is configured to implement optical coupling between the first waveguide and the second waveguide.

Cookies help us deliver our services. By using our services, you agree to our use of cookies.