THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS

Organization Name

Shin-Etsu Chemical Co., Ltd.

Inventor(s)

Wataru Toya of Annaka-shi (JP)

Mitsuhiro Iwata of Takasaki-shi (JP)

Kunihiro Yamada of Takasaki-shi (JP)

Kazuyuki Matsumura of Takasaki-shi (JP)

THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS

This abstract first appeared for US patent application 18726482 titled 'THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR APPARATUS

Original Abstract Submitted

A thermal conductive silicone composition including: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 100,000 mm/s and not containing an alkoxysilyl group; (B) an organopolysiloxane containing an alkoxysilyl group; (C) one or more thermal conductive fillers selected from irregular-shaped, round, and polyhedral fillers having a thermal conductivity of 10 W/m·K or more; and (D) hydrophobic spherical silica particles having a Din a range of 0.005 to 1 μm and a D/Dof 3 or less in a volume-based particle size distribution and having an average circularity of 0.8 to 1, wherein an amount of the component (C) is 40 to 85% by volume of the entire thermal conductive silicone composition.