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18726285. DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS (Tokyo Electron Limited)

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DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS

Organization Name

Tokyo Electron Limited

Inventor(s)

Hirokazu Ueda of Osaka (JP)

Masafumi Asano of Tokyo (JP)

Takanobu Kaitsuka of Yamanashi (JP)

Yuji Otsuki of New York NY (US)

Yasutoshi Umehara of Tokyo (JP)

DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS

This abstract first appeared for US patent application 18726285 titled 'DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS

Original Abstract Submitted

There is provided a determination method comprising: a post-embedding measurement step for performing spectroscopic measurement on a substrate in which a pattern including a recess is formed, the recess having an embedding material embedded therein, and measuring an absorbance spectrum of the substrate having the embedding material embedded therein; and a determination step for determining an embedded state of the recess based on an integrated value of an intensity of the measured absorbance spectrum of the substrate at a plurality of wavenumbers.

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