18725177. PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
PRINTED WIRING BOARD
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
PRINTED WIRING BOARD
This abstract first appeared for US patent application 18725177 titled 'PRINTED WIRING BOARD
Original Abstract Submitted
A printed wiring board includes: a base material having a main surface; a conductive pattern that is disposed on the main surface; and a plating layer. A through hole is formed in the base material. The through hole extends through the base material in a thickness direction. A thickness of the base material is 0.5 mm or more. The plating layer is disposed on at least an inner wall surface of the through hole and electrically connected to a portion of the conductive pattern around the through hole. A thickness of the plating layer on the inner wall surface of the through hole is greater than a thickness of the conductive pattern and 10 μm or more.