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18710303. ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS (ams-OSRAM International GmbH)

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ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS

Organization Name

ams-OSRAM International GmbH

Inventor(s)

Siegfried Herrmann of Neukirchen (DE)

ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS

This abstract first appeared for US patent application 18710303 titled 'ARRANGEMENT AND METHOD FOR TESTING OPTOELECTRONIC COMPONENTS



Original Abstract Submitted

In an embodiment a wafer includes a plurality of optoelectronic components and means for testing at least one of the optoelectronic components for at least one parameter, wherein the plurality of optoelectronic components includes at least one light-emitting layer, which is arranged between an insulating layer and a light emission layer, wherein the insulating layer of at least one optoelectronic component comprises a first contact and a second contact arranged on the light emission layer of the at least one optoelectronic component, and wherein the second contact is arranged outside a light emission surface of the at least one optoelectronic component.

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