18701394. MODULAR HIGH CAPACITY CURRENT LEAD (Massachusetts Institute of Technology)
MODULAR HIGH CAPACITY CURRENT LEAD
Organization Name
Massachusetts Institute of Technology
Inventor(s)
Alexander Zhukovsky of Brighton MA (US)
Philip Michael of Cambridge MA (US)
Ernest Ihloff of Hampstead NH (US)
William Beck of Alton Bay NH (US)
MODULAR HIGH CAPACITY CURRENT LEAD
This abstract first appeared for US patent application 18701394 titled 'MODULAR HIGH CAPACITY CURRENT LEAD
Original Abstract Submitted
A high capacity current lead () comprises components that are electrically coupled using indium joints. The current lead includes a heat exchanger having a portion at room temperature () and a portion () within a vacuum cryostat. The room-temperature portion is temperature controlled against both overheating and over-cooling. The cryogenic portion () of the heat exchanger is electrically coupled to a coolant boiling chamber () using indium joints. The boiling chamber () has a lid and a base that may be electrically coupled using indium joints, or they may be brazed. The boiling chamber () is surrounded by a vacuum lid that may be electrically coupled to the base using indium joints, or brazed. The base is electrically coupled to a superconductor module () having high-temperature superconductor (HTS) tapes for conveying current to a device, such as a superconducting electromagnet.