18692909. SEMICONDUCTOR PACKAGE (LG INNOTEK CO., LTD.)
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18692909 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package according to an embodiment includes an first insulating layer; a first pad disposed on the first insulating layer; and a first protective layer disposed on the first insulating layer and having a first through hole vertically overlapping the first pad, wherein an inner wall of the first through hole includes a contact surface in contact with a side surface of the first pad, and a non-contact surface located on the contact surface, and wherein a ratio of a thickness of the contact surface to a thickness of the first pad is 1:2 or more and less than 1:1.