18686939. SUBSTRATE PROCESSING METHOD (EBARA CORPORATION)
SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Masayuki Nakanishi of Tokyo JP
SUBSTRATE PROCESSING METHOD
This abstract first appeared for US patent application 18686939 titled 'SUBSTRATE PROCESSING METHOD
Original Abstract Submitted
The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.