SEMICONDUCTOR PACKAGE AND RELATED METHODS

Organization Name

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor(s)

SEMICONDUCTOR PACKAGE AND RELATED METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18676316 titled 'SEMICONDUCTOR PACKAGE AND RELATED METHODS

The patent application describes an image sensor package that includes an image sensor chip, a first layer with an opening coupled to one side of the chip, and an optically transmissive cover attached to the first layer. The package forms a cavity that encloses the image sensor chip, with at least one electrical contact on the opposite side of the chip and an encapsulant coating the sidewalls of the package.

Image sensor package with image sensor chip, first layer, and optically transmissive cover
Cavity formed by the cover, layer, and chip
Electrical contact on the opposite side of the chip
Encapsulant coating the sidewalls of the package

Potential Applications: - Consumer electronics such as smartphones, tablets, and digital cameras - Automotive applications for driver assistance systems and autonomous vehicles - Medical imaging devices for diagnostics and monitoring

Problems Solved: - Protection of the image sensor chip from external elements - Enhanced optical performance with the optically transmissive cover - Secure electrical connections with the electrical contacts

Benefits: - Improved image quality and reliability - Increased durability and longevity of image sensor packages - Enhanced functionality in various applications

Commercial Applications: Title: "Innovative Image Sensor Packages for Enhanced Performance in Consumer Electronics and Automotive Systems" This technology can be utilized in the development of high-quality cameras for smartphones, tablets, and digital cameras, as well as in advanced driver assistance systems for vehicles. The market implications include improved image sensor packages that can provide better performance and durability in a wide range of consumer and automotive applications.

Questions about Image Sensor Packages: 1. How does the optically transmissive cover enhance the performance of the image sensor package? 2. What are the potential challenges in integrating this technology into different consumer electronics and automotive systems?

Original Abstract Submitted

Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may form a cavity within the image sensor. The image sensor package may also include at least one electrical contact coupled to a second side of the image sensor chip opposing the first side and an encapsulant coating an entirety of the sidewalls of the image sensor package.