SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18675881 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

The method of manufacture for a semiconductor package involves forming a molding member on the side surfaces of the semiconductor chips, attaching a carrier substrate to the upper surfaces of the molding member and the semiconductor chips using an adhesive, and cutting away selected portions of the carrier substrate and adhesive to separate the package structure.

Molding member is formed on side surfaces of semiconductor chips.
Carrier substrate is attached to upper surfaces of molding member and semiconductor chips using adhesive.
First blade cuts away selected portions of carrier substrate and adhesive.
First blade partially cuts into upper surface of molding member to form a cutting groove.
Second blade cuts through lower surface of molding member to form a second cutting groove.
Combination of cutting grooves separates the package structure, supporting the semiconductor chip on a cut portion of the carrier substrate.

Potential Applications: - Semiconductor packaging industry - Electronics manufacturing

Problems Solved: - Efficient separation of semiconductor chips in a package structure - Secure attachment of carrier substrate to molding member

Benefits: - Improved manufacturing process for semiconductor packages - Enhanced structural integrity of package structures

Commercial Applications: - Semiconductor packaging companies - Electronics manufacturers

Questions about Semiconductor Package Manufacturing: 1. How does the method of using two blades improve the separation process in semiconductor packaging? 2. What are the advantages of attaching the carrier substrate to the molding member using adhesive in this manufacturing method?

Original Abstract Submitted

A method of manufacture for a semiconductor package includes; forming a molding member on side surfaces of the semiconductor chips, using an adhesive to attach a carrier substrate to upper surfaces of the molding member and the semiconductor chips, using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of semiconductor chips, using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate and bonding the package structure to an upper surface of a package substrate.