SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

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SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

This abstract first appeared for US patent application 18674207 titled 'SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Original Abstract Submitted

A semiconductor device includes a first chip structure that includes a memory structure and a cell routing interconnection structure that is electrically connected to the memory structure, a second chip structure that is on the first chip structure and includes a first peripheral circuit, a second peripheral circuit, a first peripheral routing interconnection structure that is electrically connected to the first peripheral circuit and the cell routing interconnection structure, and a second peripheral routing interconnection structure that is electrically connected to the second peripheral circuit, and a connection structure that extends into the first chip structure and the second chip structure, where the connection structure includes: a first connection pad, a second connection pad that overlaps the first connection pad, and an intermediate connection structure that is between the first connection pad and the second connection pad and is electrically connected to the second peripheral routing interconnection structure.